Next-generation data center connectivity for 400G and the future

                                    SN-SC simplex jumper

For operators struggling with the reduction of data center space, it is an effective method to realize the LC duplex connection and the hardware compatible with the LC-MDC jumper. This not only allows the LC duplex interface to be retained on the transceiver side, but the port density using MDC in the same size module can be increased by up to 3 times-imagine that a 1U rack unit can accommodate 432 cores instead of now 144 cores.

Ultra-small connectors also help reduce the total cost of ownership. Various optical component manufacturers have begun to provide solutions for these connectors, but it is important to find the best cabling infrastructure solutions that also allow the continued use or reuse of existing components. This in turn helps to minimize the initial investment while meeting future scalability requirements.

In addition to SN and MDC, CS Corning-Senko Duplex (CS) represents another option in the ultra-small connector space. It should be noted that although these three types all accommodate two-core optical fibers, there are many differences in their design and function, including the vertical/horizontal dimensions of the optical fiber. SN and MDC can also be combined as 4x2 core connectors, which is not possible with CS connectors. In view of these differences, the CS, MDC and SN interfaces are not compatible, so this has an impact on the required optical transceiver interface and passive connection components.

Beyond pluggable optics

The future of the data center industry will see various technological advancements, which will help us achieve higher data rates-from 40G to 100G to 400G all the way to 1.6T.

The use of pluggable optics may still play an important role up to 800G, and it can be expected that the above-mentioned connection interfaces will be developed in the future. However, for 1.6T, high density and power consumption requirements mean that pluggable optics may not be the best solution.

When it comes to these higher data rates, there is another approach, the joint packaging solution. Here, data transmission and data processing are combined with semiconductor components. For example, Intel demonstrated the recently released co-packaged Ethernet switch. By doing so, co-packaged optical devices are expected to increase density, reduce latency, reduce power consumption, and reduce switch size.

Achieving these data rates will mean going beyond the ultra-small connectors mentioned earlier. In the expanded beam area, further developments are expected to enable more applications on connectors (such as USConec MXC connectors or 3M EBO). New developments such as multi-core fiber (MCF) and reduced cladding fiber will also have a real impact on the further development of connectors.

Preparation is the key

The long-term challenge for data center operators is to ensure that the network and structural cabling design remains flexible to minimize cabling infrastructure costs when upgrading to 400G and higher network speeds.

Careful planning and preparation will avoid costly upgrades and further changes. It is an important part of increasingly compact connectors and fiber management. The construction of a 400G network can serve large-volume ultra-large-scale data centers, multi-tenant data centers and enterprises. data center.

【Editor's Choice】